FR4 Copper Clad Laminate Boards
Copper Clad Laminate Board is a kind of copper foil covered laminated board formed
through heat pressing after the electric industry alklifree glass fibre dips into
epoxy resins and is covered with copper foil(s) at one side or both sides.
The thickness: 0.6mm,0.8mm,1.0mm,1.6mm,2.0mm and so on.
1.6mm thickness is most popular.
1) Outside appearance:
a) The end face of foil covered board should be tidy without any delamination
b) Any bubble, wrinkle, pin hole, deep nick, pitting and glue spot on the copper
foil covered face is not allowed. Any color changing or dirty can be easily
removed by density 1.02 g/cm3 hydrochloric acid or proper organic solution
c) On laminated face, the defects such as bubble, impressed pitting, nick and
glue lack and outer impurity which retard its use are not allowed
2) The foil covered board should meet with the requirements of all items of non electric
performance listed at table 2.
3) Non performance of insulation basic material after all copper foil removal.
a) On insulation basic material, the pitting, cavity hole, glue lack, white spot,
loosen or outer impurity (including solid resin grains) which retard its use
are not allowed. The color should be uniform. A little irregular change of color
b) After all copper foils on the foil covered board are removed according to
the stipulations on Chapter 3 of GB/T4722, the insulation basic material
performance should meet with the stipulation on table 3.
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